Place of Origin: | China |
Brand Name: | OEM |
Certification: | ISO9001 |
Minimum Order Quantity: | Negotiable |
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Price: | Negotiable |
Packaging Details: | 100g/bag or single wafer box packaging |
Delivery Time: | 5-7 working days after received your payment details working days after received your payment details |
Payment Terms: | T/T, Western Union, L/C |
Crystal Structure: | FCC A=3.610Å | Growth Method: | Bridgeman |
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Surface Roughness: | 30~100 A | Purity: | 99.9999% |
Melt Point: | 1083 °C | Boiling Point: | 2567 °C |
High Light: | silicon substrate,silicon wafer substrate |
Cu Single Crystal for the substrate metal, alloy thin film materials and biomaterials
Typical Physical Properties of Cu Single Crystal
Crystal Structure |
FCC a=3.610Å |
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Growth Method |
Bridgeman |
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Density |
8.96 g/cm3 |
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Melt Point |
1083 °C |
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Boiling Point |
2567 °C |
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Surface Roughness |
30~100 A |
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Purity |
99.9999% |
Xrd and Rocking Curve of Cu Single Crystal
Orientation: <100>+/-2.0degree
Orientation: <110>+/-2.0degree
Orientation: <111>+/-2.0degree
Contact Person: Ms. Linda
Tel: +86-19945681435
Address: Rm 1712-1715, No.88, Sibao Rd, Shanghai , China